R&D Thin Films Engineer
imec
Leuven
Posted
R&D Thin Films Engineer Background Advances in AI and semiconductor technologies are increasingly intertwined, with AI driving new demands for faster, more efficient chips, while cutting‑edge semiconductor innovations enable the next generation of AI workloads. This needs continuous development and innovation in cutting edge logic and memory architectures. What you will do You will be a member of the Dielectrics for Advanced Semiconductor Technology (DAST) group within the Materials, Interfaces…