R&D Engineer - Deposited Resists
imec
Leuven
Posted
R&D Engineer - Deposited Resists Background Continued device scaling and the introduction of increasingly complex three-dimensional architectures place demanding requirements on lithographic materials. Conventional spin-coated resists face challenges related to film thickness control, conformality, patterning performance, and integration on non-planar structures. Deposited resists offer a promising route toward highly controlled, uniform, and conformal resist layers with tunable composition and…